Sheet-shaped Silicone Pads Commonly Used for Heat Dissipation in Electronic Products
Temperature:-45°C to +220°C
Use:For Thermal Conduction on Circuit Boards, Chassis, and Chips
Product Paramenters
Product Name
Sheet-shaped Silicone Pads Commonly Used for Heat Dissipation in Electronic Products
Type
Sheet-shaped Silicone Pads
Material
Silicone
Size
Can be customized
Thickness
Can be customized
Size
Can be customized on request
Specification
Any customized specifications
Operating temperature
-45°C to +220°C
Use
For Thermal Conduction on Circuit Boards, Chassis, and Chips
Contact Information: +86 17776573759
Email: linameng@gsfiberconnectors.com
Website: https://www.gsfiberconnectors.com
Address：Room 202, No. 3 Kangxiang East Street, Chang'an Town, Dongguan City, Guangdong Province
